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MAX11634–MAX11637
12-Bit, 300ksps ADCs with Differential
Track/Hold, and Internal Reference
2
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ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VDD = 2.7V to 3.6V (MAX11635/MAX11637), VDD = 4.75V to 5.25V (MAX11634/MAX11636), fSAMPLE = 300kHz, fSCLK = 4.8MHz
(external clock, 50% duty cycle), VREF = 2.5V (MAX11635/MAX11637), VREF = 4.096V (MAX11634/MAX11636) TA = TMIN to TMAX,
unless otherwise noted. Typical values are at TA = +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VDD to GND ..............................................................-0.3V to +6V
CS, SCLK, DIN, EOC, DOUT to GND.........-0.3V to (VDD + 0.3V)
AIN0–AIN5, REF-/AIN6, CNVST/AIN7,
REF+ to GND.........................................-0.3V to (VDD + 0.3V)
Maximum Current into any Pin ............................................50mA
Continuous Power Dissipation (TA = +70°C)
QSOP (single-layer board)
(derate 8.3mW/°C above +70°C) .................................667mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-60°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC ACCURACY (Note 3)
Resolution
RES
12
Bits
Integral Nonlinearity
INL
±1.0
LSB
Differential Nonlinearity
DNL
No missing codes over temperature
±1.0
LSB
Offset Error
±0.5
±4.0
LSB
Gain Error
(Note 4)
±0.5
±4.0
LSB
Offset Error Temperature
Coefficient
±2
ppm/°C
FSR
Gain Temperature Coefficient
±0.8
ppm/°C
Channel-to-Channel Offset
Matching
±0.1
LSB
DYNAMIC SPECIFICATIONS (30kHz sine-wave input, 300ksps, fSCLK = 4.8MHz)
MAX11635/MAX11637
71
Signal-to-Noise Plus Distortion
SINAD
MAX11634/MAX11636
73
dB
MAX11635/MAX11637
-80
Total Harmonic Distortion
THD
Up to the 5th
harmonic
MAX11634/MAX11636
-88
dBc
MAX11635/MAX11637
81
Spurious-Free Dynamic Range
SFDR
MAX11634/MAX11636
89
dBc
Intermodulation Distortion
IMD
fIN1 = 29.9kHz, fIN2 = 30.2kHz
76
dBc
Full-Power Bandwidth
-3dB point
1
MHz
Full-Linear Bandwidth
S/(N + D) > 68dB
100
kHz
PACKAGE THERMAL CHARACTERISTICS (Note 1)
QSOP
Junction-to-Ambient Thermal Resistance (
θJA)...............105°C/W
Junction-to-Case Thermal Resistance (
θJC)......................37°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
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